产品技术

• 封装品种
  • BUMP SERIES
  • FLIP CHIP SERIES
  • DFN/QFN SERIES
  • QFP SERIES
    • tqfp-1.00mm
    • LQFP-1.40mm
    • QFP-2.75mm
  • SOP SERIES
    • Mini SOP
    • TSSOP173mil & 240mil
    • SSOP165
    • SOP150mil
  • DIP SERIES
    • DIP750mil
    • DIP600mil
    • DIP400mil
    • DIP300mil
  • SOT SERIES
  • TO SERIES
  • SIP SERIES
• 测试能力
• 技术优势
• 下载专区